Communicating with an Electronic Module that is Slidably Mounted in a System

ABSTRACT

A system comprises an electronic module slidably mounted in the system, a first assembly including at least one wireless transceiver mounted in the system, and a second assembly including at least one wireless transceiver to communicate wirelessly with the wireless transceiver of the first assembly. The second assembly is attached to the electronic module, and the wireless transceivers of the first and second assemblies continue communicating as the electronic module is slidably moved in the system.

CROSS-REFERENCE TO RELATED APPLICATION

This is a continuation of U.S. Ser. No. 11/039,042, entitled“Communicating with an Electronic Module that is Slidably Mounted in aSystem,” filed Jan. 20, 2005, which is hereby incorporated by reference.

BACKGROUND

Certain electronic systems, such as high-end computer server systems,storage server systems, telecommunications switch systems, and so forth,include a plurality of electronic modules, such as processing modules,storage modules, switch modules, and so forth. The multiple electronicmodules are typically mounted inside a cabinet of the electronic system.

In a first type of computer server system, for example, the processingmodules are electrically connected together by electrical wires. Eachprocessing module can include a relatively large number of components,including multiple processors and other components. Consequently, therecan be a relatively large number of electrical wires connecting theprocessing modules. Electrical wire management in computer serversystems has become a major industry concern, as the amount of electricalwires present in the system affects the mechanical packaging of thecomputer server system.

If there are a large number of processing modules in the computer serversystem, then the relatively large number of electrical wires that haveto be provided in the cabinet can become unwieldy. A high density ofelectrical wires inside the cabinet may result in reduced airflow withinthe cabinet, which may adversely affect the ability to cool componentsof each processing module. To further exacerbate the electrical wiringissue, extra lengths are often added to the electrical wires connectedto the processing modules to enable sliding withdrawal of a processingmodule from a server cabinet for servicing. By making the electricalwires longer than necessary, a processing module can remain powered (andtherefore available to users of a network environment, for example) evenas the processing module is withdrawn from the server cabinet forservicing.

A second type of computer server system uses a backplane. Processingmodules are electrically connected (by wires) to the backplane. Thebackplane is made up of interconnect circuitry to enable communicationbetween the processing modules. Although the complexity of electricalwiring is reduced with this configuration, an issue of the second typeof computer system is that it may be difficult to pull out a processingmodule for servicing without shutting down the processing module. Toenable servicing of individual processing modules while the processingmodule remains live, relatively complicated solutions may often have tobe employed, which add to the cost and complexity of the computer serversystem.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates a computer server system that includes slidablymounted processing modules according to an embodiment.

FIG. 2 is a side view of the processing modules in the computer serversystem of FIG. 1.

FIGS. 3A-3B illustrate a processing module slidably mounted, inaccordance with an embodiment, to a guide assembly that includes awireless communications conduit to communicate wireless signals betweenthe processing module and a backplane of the computer server system.

FIG. 4 is a perspective view of the guide assembly used in the computerserver system of FIG. 1, according to an embodiment.

FIG. 5 is a head assembly that is slidably engageable with the guideassembly of FIG. 4, according to an embodiment.

FIG. 6 illustrates an alternative embodiment of an arrangement of theguide assembly cooperatively coupled to a head assembly by an expandableboot, where the expandable boot is in an undeployed state.

FIG. 7 illustrates the arrangement of FIG. 6 with the expandable boot ina deployed state.

FIG. 8 illustrates a computer server system that includes slidablymounted processing modules according to another embodiment.

DETAILED DESCRIPTION

FIGS. 1 and 2 illustrate a computer server system 100 that has a cabinet102 defined by side panels 104, 106, and a rear panel 108. A pluralityof processing modules 110A, 110B, 110C, 110D (only 110A, 110B, 110Cdepicted in FIG. 1) are slidably mounted in the cabinet, within achamber defined by the side panels 104, 106, and rear panel 108. Theprocessing module 110A includes a sliding profile 118A to enable slidingengagement of the processing module 110A inside the cabinet 102. Thesliding profile 118A is on the right side of the processing module 110A.Another sliding profile is provided on the left side of the processingmodule 110A. Similar sliding profiles 118B, 118C, 118D are provided onthe other processing modules 110B, 110C, 110D. Although four processingmodules are depicted in FIGS. 1-2, it is contemplated that differentimplementations can use different numbers of processing modules (one orgreater). Also, in a different implementation, a different mountingmechanism can be used to mount each processing module in the cabinet102.

Various components 116A are provided on a surface of the processingmodule 110A. Similar components are also mounted on the other processingmodules 110B, 110C, 110D. Although some embodiments of the invention aredescribed in the context of the computer server system 100, it iscontemplated that embodiments can be incorporated into other types ofelectronic systems, such as storage server systems, telecommunicationswitch systems, and so forth. In such other electronic systems, theprocessing modules 110 are replaced with storage modules, switchmodules, and so forth.

In accordance with some embodiments of the invention, instead ofinterconnecting each processing module 110 with electrical wires,wireless communication (optical wireless communication, electromagneticwireless communication, and so forth) is performed between eachprocessing module 110 and a backplane 150 (FIG. 2). In one embodiment,the wireless communication is performed through a guide assembly thatincludes a wireless communications conduit (e.g., 120A betweenprocessing module 110A and the backplane 150) connected to a headassembly (e.g., 122A connected to wireless communications conduit 120A).The head assembly 122A is connected to the backplane 150 (FIG. 2). Theother processing modules 110B-110D are similarly slidably mounted torespective wireless communications conduits, which are in turn connectedto respective head assemblies similar to head assembly 122A.

The backplane 150 can include electrical conductors (e.g., electricalwires, electrically conductive traces, etc.) for communication of powerand signals. Alternatively, the backplane 150 can include structures toenable wireless communications over the backplane 150. Generally, thebackplane 150 provides an interconnect structure that enablescommunications interconnection between the processing modules.

The head assembly 122A includes one or more wireless transceivers tocommunicate wireless signals through the wireless communications conduit120A. Although not depicted in FIG. 1, the processing module 110A alsohas a head assembly that is slidably mounted to the wirelesscommunications guide 120A to enable relative slidable movement of theprocessing module 110A with respect to the wireless communicationsconduit 120A.

The wireless communications conduit 120A is used to communicate control,address, and data signals with the processing module 110A. An electricallink 103A (such as a cable) is used to communicate power from thebackplane 150 to the processing module 110A. Similar electrical cablesare used to provide power to the other processing modules.

As depicted in FIGS. 1 and 2, the processing module 110A is in anextended position (the processing module 110A is pulled out from thechamber of the cabinet 102), whereas the processing modules 110B, 110C,and 110D are in a retracted position (the processing modules 110B, 110C,and 110D are positioned inside the chamber of the cabinet 102). Althoughthe processing module 110A is in the extended position, the wirelesscommunications conduit 120A enables continued wireless communicationsbetween the processing module 110A and the head assembly 122A such thatoperation of the processing module 110A can continue even though theprocessing module 110A is in the extended position.

By using the wireless communications conduits 120 according to someembodiments, wireless rather than wired signals are used forcommunication between the respective processing modules 110 and thebackplane 150. Consequently, the large number of electrical wirestypically found in conventional server cabinets is substantiallyreduced. The reduction of electrical wires allows more convenientmanipulation (e.g., mounting, dismounting, etc.) of processing modulesby users. Also, airflow inside the server cabinet is increased byreducing obstructions inside the cabinet, which helps in coolingcomponents of the processing modules. A further benefit of the guideassembly that enables slidable movement of a processing module withrespect to the wireless communications conduit is that the processingmodule can be maintained in an active state (powered and operational)while the processing module is withdrawn from the server cabinet forservice.

FIGS. 3A-3B depict a cutout portion of a processing module 110 toillustrate the portion of the guide assembly that is within theprocessing module 110. A head assembly 152 that is slidably mounted tothe wireless communications conduit 120 is provided at a fixed positionwith respect to the processing module 110. In the example shown in FIGS.3A-3B, the head assembly 152 is located inside the processing module110. Alternatively, the head assembly 152 can be located outside theprocessing module 110, but attached to the processing module 110. InFIG. 3A, the processing module 110 is in its retracted position suchthat the head assemblies 122 and 152 are proximate each other (spacedapart by a first distance). Each of head assemblies 122 and 152 includesat least one wireless transceiver to communicate wirelessly with eachother. In the retracted position of FIG. 3A, substantially the entireportion of the wireless communications conduit 120 is contained withinthe inner chamber 154 of the processing module 110. The portion of thewireless communications conduit 120 within the chamber 154 of theprocessing module 110 is labeled 120_2.

FIG. 3B depicts the processing module 110 in the extended position. Inthis position, the head assembly 152 has slid over a portion 120_1 ofthe wireless communications conduit 120 such that the portion 120_2within the chamber of the processing module 110 is shorter than theportion 120_2 in FIG. 3A. The slidable movement of the head assembly 152over the wireless communications conduit 120 causes the head assemblies122 and 152 to be spaced apart by a second distance that is greater thanthe first distance (when the head assemblies are proximate each other).However, even though the head assemblies 122 and 152 are spaced apart bythe length of the wireless communications conduit portion 120_1, thewireless transceivers of the head assemblies 122 and 152 are stillcapable of communicating with each other through the wirelesscommunications conduit portion 120_1.

According to one embodiment, the wireless communications conduit 120enables the communication of optical signals between opticaltransceivers in the head assemblies 122 and 152. In an alternativeembodiment, instead of optical signals, the head assemblies 122 and 152can include other types of wireless transceivers, such as radiofrequency (RF) or other forms of electromagnetic (EM) transceivers forcommunicating other types of wireless signals.

FIG. 4 shows a portion of the guide assembly described above inconnection with FIGS. 1-3B. The guide assembly has a wirelesscommunications conduit 120 with a first end 220 connected to the headassembly 122 and a second end 222 connected to the head assembly 152(FIGS. 3A-3B). In the embodiment depicted in FIG. 4, the wirelesscommunications conduit 120 has a plurality of channels 214, 218 alongwhich wireless signals can be transferred. The channels 214 are definedby side walls 208 and 210 and intermediate dividers 212. The channels214 are formed on one side of a central structure 216, whereas thechannels 218 are formed on the other side of the central structure 216.The channels 218 are defined by the side walls 208, 210 and intermediatedividers 211. In the optical communication embodiment, the channels 214,218 are used to guide optical signals between respective opticaltransceivers in the head assemblies 122, 152.

In alternative embodiments, the wireless signals can be communicatedbetween transceivers in the head assemblies 122 and 152 without the useof channels. In yet another embodiment, the channels can be completelycovered on all four sides to provide better shielding of signalscommunicated through the channels. Other types and shapes of channelscan also be used in other embodiments.

A portion of the side wall 208 has been cut away (indicated by 206) todepict a wireless transceiver 204 mounted to a surface 202 of the headassembly 122. In one embodiment, the transceiver 204 is an opticaltransceiver to transmit and receive optical signals along acorresponding channel 214, 218. Thus, in the embodiment depicted in FIG.4, each channel 214, 218 is associated with a corresponding wirelesstransceiver 204 mounted to the head assembly 122.

Similarly, as depicted in FIG. 5, corresponding wireless transceivers308 are mounted to a surface 305 of the head assembly 152 forcommunicating wireless signals across corresponding channels 214, 218(FIG. 4) of the wireless communications conduit 120 with correspondingwireless transceivers 204 mounted to the head assembly 122.

The head assembly 152 (attached to the processing module 110 as depictedin FIGS. 3A-3B) has end slots 302 and 304 through which side walls 210and 208 (FIG. 4) of the wireless communications conduit 120 are able topass. Also, the head assembly 152 has additional intermediate slots 306and 310 to receive respective dividers 214 and 211. A central opening312 is provided to receive the central structure 216 (FIG. 4) of thewireless communications conduit 120. The slots 302, 304, 306, 310 andthe central opening 312 enable slidable engagement between the headassembly 152 and the wireless communications conduit 120, such that thehead assembly 152 and the wireless communications conduit 120 areslidable with respect to each other along the length of the wirelesscommunications conduit 120 (as depicted in FIGS. 3A-3B). During slidingmovement of the head assembly 152 with respect to the wirelesscommunications conduit 120, the wireless transceivers 308 can continueto communicate with corresponding wireless transceivers 204 at the headassembly 122 on the other end of the guide assembly.

In a different embodiment, the positions of the head assemblies 122 and152 can be switched with the head assembly 122 attached to theprocessing module and the head assembly 152 connected to the backplane.

The head assembly 152 includes converters (not shown) to convert betweenoptical signals and electrical signals that are provided through a cable155. The cable 155 has multiple electrical wires or circuits forcommunicating corresponding electrical signals to electrical componentsof the processing module 110.

Another embodiment of the guide assembly is depicted in FIG. 6, where anexpandable boot 402 is connected between the head assemblies 122 and152. FIG. 6 shows the expandable boot in an undeployed state (the stateassociated with the head assemblies 122 and 152 being proximate eachother when the processing module 110 is in its retracted state withinthe server cabinet 102). The expandable boot 402 provides a dust coverto prevent dust or other particles from entering the channels of thewireless communications conduit 120.

FIG. 7 shows the guide assembly of FIG. 6 in its deployed state, wherethe head assemblies 122 and 152 are spaced apart when the processingmodule 110 is in the extended position (withdrawn from the servercabinet 102). The expandable boot 402 is in its expanded state.

In alternative embodiments, for more convenient manipulation by the userof the processing module 110 as the processing module 110 is withdrawnfrom or retracted back into the server cabinet 102, the connectionbetween the wireless communications conduit 120 and the head assembly122 and/or 152 can be hinged such that a slight amount of pivoting canoccur between the head assembly 122 and/or 152 and the wirelesscommunications conduit 120.

FIG. 8 shows another embodiment of the computer server system 100A,which is identical to the computer server system 100 of FIG. 1 exceptthat a guide assembly including a wireless communications conduit 120 isomitted in the FIG. 8 embodiment. A first head assembly 500 is fixedlymounted in the server cabinet 102, such as to the backplane 150 (FIG.2). The first head assembly 500A has plural wireless transceivers 502A(e.g., optical transceivers, electromagnetic transceivers, etc.). Asecond head assembly 504A is attached to the processing module 110A. Thesecond head assembly 504A has plural transceivers 506A. The wirelesstransceivers 504A and 506A communicate with each other through freespace across the distance between each pair of wireless transceivers504A and 506A. Each pair of wireless transceivers 504A, 506A are alignedso that they can continue to communicate with each other even as theprocessing module 110A is moved between an extended position (withdrawnfrom server cabinet 102) and a retracted position (located inside servercabinet 102). Depending on the criticality of the alignment, alignmentcan be done by limiting tolerances or other self-aligning techniques.

Additional pairs of head assemblies 500, 504 are provided for the otherprocessing modules 110B, 110C shown in FIG. 8.

In the foregoing description, numerous details are set forth to providean understanding of the present invention. However, it will beunderstood by those skilled in the art that the present invention may bepracticed without these details. While the invention has been disclosedwith respect to a limited number of embodiments, those skilled in theart will appreciate numerous modifications and variations therefrom. Itis intended that the appended claims cover such modifications andvariations as fall within the true spirit and scope of the invention.

1. A system comprising: an electronic module slidably mounted in thesystem; a first assembly including at least one wireless transceivermounted in the system; a second assembly including at least one wirelesstransceiver to communicate wirelessly with the wireless transceiver ofthe first assembly, the second assembly attached to the electronicmodule; and a wireless communications conduit provided between the firstand second assemblies, wherein wireless signals communicated between thewireless transceivers of the first and second assemblies are transmittedthrough the wireless communications conduit, the wireless transceiversof the first and second assemblies to continue communicating as theelectronic module is slidably moved in the system, and at least aportion of the wireless communications conduit is received inside aninner chamber of the electronic module as the electronic module isslidably retracted into the system.
 2. The system of claim 1, furthercomprising a cabinet, the electronic module slidably mounted in thecabinet, and the first assembly mounted in the cabinet.
 3. The system ofclaim 1, wherein the transceivers comprise optical transceivers.
 4. Thesystem of claim 1, wherein the second assembly is slidable along thewireless communications conduit, wherein the second assembly has firststructures that are engaged with second structures of the wirelesscommunications conduit as the second assembly slides along the wirelesscommunications conduit.
 5. The system of claim 4, wherein the secondstructures of the wireless communications conduit comprise dividers todefine channels for communicating wireless signals, and wherein thefirst structures of the second assembly comprise slots to receive thedividers to enable the second assembly to slide along the wirelesscommunications conduit.
 6. A system comprising: an electronic module;and a wireless communications conduit slidably connected to theelectronic module, the wireless communications conduit to transferwireless signaling through the wireless communications conduit to theelectronic module, wherein the electronic module is slidable along thewireless communications conduit between at least two positions.
 7. Thesystem of claim 6, wherein the wireless communications conduit hasplural channels to transfer respective plural wireless signals.
 8. Thesystem of claim 7, wherein the plural channels are adapted to transferrespective plural optical signals.
 9. The system of claim 8, furthercomprising a first assembly connected to the wireless communicationsconduit, the first assembly having plural optical transceivers tocommunicate optical signals along the respective plural channels. 10.The system of claim 9, further comprising a second assembly attached tothe electronic module and having first structures, and wherein thewireless communications conduit has second structures to engage thefirst structures to enable slidable movement of the second assemblyalong the wireless communications conduit.
 11. The system of claim 10,wherein the second assembly has comprising plural optical transceiversto communicate optical signals along the respective plural channels. 12.The system of claim 11, wherein the second assembly further comprises anelectrical cable connected to the electronic module, the second assemblyto couple optical signals to the electronic module.
 13. The system ofclaim 12, wherein the second assembly is adapted to convert the opticalsignals to electrical signals for communication over the electricalcable.
 14. The system of claim 6, wherein the wireless communicationsconduit is adapted to transfer electromagnetic signals.
 15. The systemof claim 6, further comprising a backplane, the wireless communicationsconduit to transfer the wireless signaling between the electronic moduleand the backplane.
 16. The system of claim 6, wherein the electronicmodule has an inner chamber to receive at least a portion of thewireless communications conduit as the electronic module is slidablyretracted into the system.
 17. The system of claim 6, further comprisinga wireless transceiver, wherein the electronic module has an extendedposition when the electronic module is extended from the system, andwherein the electronic module has a fully retracted position inside thesystem, wherein the wireless communications conduit enables wirelesscommunication between the electronic module and the wireless transceiverover the wireless communications conduit in both the extended positionand the fully retracted position.
 18. An apparatus to enable wirelesscommunication between an electronic module and an interconnectstructure, comprising: a wireless communications conduit; a firstassembly connected to the interconnect structure and the wirelesscommunications conduit, wherein the first assembly has at least a firstwireless transceiver; and a second assembly for attachment to theelectronic module, the second assembly slidably mounted on the wirelesscommunications conduit, wherein the second assembly has at least asecond wireless transceiver to communicate wirelessly with the firstwireless transceiver over the wireless communications conduit.
 19. Theapparatus of claim 18, wherein the second assembly is slidable over thewireless communications conduit between a first position and a secondposition, wherein at the first position the first and second assembliesare spaced apart by a first distance, and wherein at the second positionthe first and second assemblies are spaced apart by a second, greaterdistance.
 20. The apparatus of claim 19, wherein wireless communicationsconduit has first structures, and wherein the second assembly has secondstructures to engage the first structures to enable sliding movement ofthe second assembly along the wireless communications conduit.